Alongside the active COB assemblies, a circuit board necessarily comprises a diversity of active and passive components. We are able to insert and solder these components up to a medium degree of complexity, both in series and single specimens. Special-purpose assembly work is similarly possible, e. g. solid solder ball placement or balling of solder depots for BGA-like packages.
At First Sensor, all types of soldering components are packaged. Depending on the requirement, components are fixed through bonding after packaging. In the case of critical component sizes and increased temperature requirements, electronic printed circuit boards (PCB) with a lower expansion coefficient are used (low CTE PCB). The subsequent soldering is done via reflow procedure (hot air or vapor phase).
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Please search by complete product numbers, e.g. CTE7005GY4 or 501430. In order to increase the number of search results, please search by part of the product number only, e.g. CTE7.