Chip bonding

The use of bare dice offers many advantages compared to conventional components such as Surface Mounted Devices (SMD). Chip bonding refers to a technique by which the individual chips of a wafer are attached to a substrate using an appropriate adhesive.

Our technologies

Chip-on-Board (COB)
Flip-Chip
Chip-on-Glass (COG)
Chip-on-Metal (COM)
Chip-on-Flex (COF)
Chip-on-Ceramic (COC)
Die Stacking

Advantages of using bare dice

Miniaturization through size reduction
Reduction of contact points and thus improved reliability
Very good thermal adaptation to (ceramic-) printed circuit board
Hermetic seal possible (plastic components can absorb moisture and release it again inside a casing)
Exact population of semiconductor optical transmitters and detectors
Reduced thermal resistance of semiconductors on heat sink, as a transition point is omitted (e.g. LEDs with p- and n-up can be directly packaged on a heat sink)

Technical parameters

Size of bare dice: 0.25 mm to 80 mm
Die picking from wafer, blue foil or waffle pack
Application of conductive adhesives by: Silk-screen printing, dispensing or stamping
Eutectic soldering of power semiconductors in a vacuum or hydrogen atmosphere, without flux
Application of solder paste to a printed circuit board (printed, dispensed or through solder preforms)
Exact positioning of bare dice (series: approx. 0.012 mm in relation to a benchmark structure or circuit carrier reference of the printed circuit board, small quantities < 0.005 mm, for special applications up to 0.001 mm )
Flip-chip population

Company

First Sensor is one of the world's leading suppliers in the field of sensor systems and part of TE Connectivity. In the growth market of sensor systems, First Sensor develops and produces customer-specific solutions for the ever-increasing number of applications in the industrial, medical, and mobility target markets. Our goal here is to identify, meet and solve the challenges of the future with our innovative sensor solutions early on.

Investor Relations

Our investor relations activities aim at raising the international publicity of First Sensor AG and at consolidating and extending the perception of our share as an attractive growth stock. This means we keep our online communication transparent, comprehensive and continuous in order to enhance your trust in our share.

Industrial

Medical

Mobility

Tailored Solutions

In the growth market of sensor systems, First Sensor develops and produces customer-specific sensors, electronics, modules and complex systems for the ever-increasing number of applications in the industrial, medical, and mobility target markets. As a solution provider the company offers complete development services from a first draft and proof of concept up to the development of prototypes and finally serial production. First Sensor offers comprehensive development expertise, state-of-the-art packaging technologies and production capacities in clean rooms from ISO class 8 to 5.

Career

Innovation, excellence, proximity – these are our values, our ambition, our drive. Anything less is not an option. Our sensor solutions stand for technical innovation and economic growth. As such, they form the basis for the development and application of new technologies in almost all areas of life. We aim to shape this future together with you.

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