Integrated Manufacturing Services

First Sensor assembles your products with state-of-the-art microsystem technology and automatic equipment in class 100,000 to class 100 clean rooms (ISO 8 to ISO 5). We can modify opto- and MEMS sensor elements in our own semiconductor production as required. The production concepts are coordinated with your required quantities and logistics requirements. In order to ensure consistently high quality and reliability, our production is subject to continuous process monitoring.

• Material logistics (raw materials, building elements and semi-finished products)
• Thick-film technology
• Soldering, SMD / THT assembly
• Chip bonding (e. g. Chip on board, Flip Chip, Die stacking)
• Wire bonding (Aluminum, gold wire and specialties)
• Encapsulation (e. g. Caps, Globtop, Hermetic seal, Coating)
• Labeling (laser or printing)
• Module and device construction, electromechanical assembly
• Recording, calibrating, adjusting, programming
• Testing (e. g. AOI, ICT, function test)
• Packaging (e. g. belts, trays) and shipping / delivery logistics

The production process is characterized by the transfer of your product from sample production to serial production, direct monitoring and monitoring of the serial transfer through our process technology as well as increased quality controls.

The traceability of your products is batch-based and database-based. On request, we can also provide traceability at the individual parts level.