Funded projects

A current research and development project is entitled "Packaging and assembly technology for optical sensors for use in autonomous driving and industry 4.0". The project started on June 1, 2019 and will end on May 31, 2021, with the support of the Sächsischen Aufbaubank. The total cost of the project is 1.6 million Euro.

In addition to First Sensor AG, which is responsible for the technology and design development for LiDAR sensors, three other partners are involved in the project: 1. viimagic GmbH is responsible for technology and design development for image sensors, 2. MSG Lithoglas GmbH, is responsible for the development of a bonding technology to directly cover optical chips with glass windows, and 3. Technische Universität Dresden, Institute of Electronic Packaging Technology (IAVT) is responsible for the investigation of a 3D stereolithography process as an encapsulation technology.

Usually, ceramic housings with glass lids are used as hermetic packages for the assembly of automotive LiDAR and image sensors. However, the disadvantages of this technology are:

• High risk of contamination during assembly
• Long bond wires cause parasitic effects
• Miniaturization of the overall assembly is limited by the size of the ceramic packages
• Limitation of thermal management within the housing
• High material costs

Packaging technologies based on printed circuit boards are much more cost-effective, but not hermetic and unsuitable for the high reliability requirements typical of the automotive industry. In particular, diffusing moisture in combination with operating voltage leads to corrosion effects on the chip surface and ultimately to the destruction of the sensor.

The project goal is therefore the development of a new automotive-suited COB housing technology for LiDAR multi-channel and image sensors based on laminate substrates. Filter glasses are to be mounted on the sensor surface directly on the sensor chip using adhesive technologies. The assembly process to be developed will be carried out at wafer or chip level. As a result, the entire assembly will be encapsulated with low stress using an innovative 3D housing technology and newly developed, adapted materials.